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Testonica delivers technology for Marginal Defect detection on DDR3/4 bus

Testonica delivers technology for Marginal Defect detection on DDR3/4 bus

Marginal Defects, such as excessive voids in solder joints, dewetting, head-in-pillow and alike do not necessarily cause malfunctions, but may result in system performance issues, increased error rates, intermittent faults and other sporadic stability issues observed in certain operation modes, at certain workloads or manifesting in a seemingly stochastic manner. As a result, Marginal Defects may lead to No Fault/Trouble Found (NFF/NTF) scenarios.

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IEEE I&M Magazine published our technical paper

IEEE I&M Magazine published our technical paper

In its Aug-Sept issue, IEEE Instrumentation & Measurement Magazine published our technical paper that was originally presented last year at AUTOTESTCON conference in Anaheim, CA. It is one of six conference papers selected for the journal on a quality basis out of the total of 80 AUTOTESTCON'2016 contributions.

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